Production Capabilities:
Min. Trace: 3 mil
Min. Space: 3 mil
Min. Hole Via: 6 mil
Hole Via Tol.: +/-2 mil
Board Thickness:20 mil~93 mil
Board Thickness Tol.: Double Sides: +/-5%, Multilayer: +/-5%
Max. Board Shape:18" x 24" (457mm x 609mm)
Shape Size Tol.: NC Routing: +/-4 mil, Mold Forming: +/-8 mil
Min. SMT Test Pitch: 4 mil
Inspection Spec.:IPC-A600-E HANSONIC SOP-001 Spec.
Return Ratio: 0.05%
Type of Boards:
Hot Air Solder Leveling Board
Nickel Plated Board
Immersion Gold
Immersion Tin
Immersion Silver
Gold Finger Plated
O.S.P.
Routed Piece Board
V-Cut Panel Board
Punching Piece Board
Break Apart Board
Push Back Panel Board
MD&M Minneapolis 2013
We are at:
Minneapolis - Oct. 29 to 30, 2013
Minneapolis - Oct. 29 to 30, 2013
ISO/TS 16949
ISO 14001
Our focus and services are part of a
wide spectrum of businesses that
involves the following areas of
expertise:
Telecommunications
Cell phone and Accessories
Phone Set, Exchanger,